Fabrication for Multilayer PCB ATE

Multilayer, Blind and Buried Vias, Controlled Impedance Builds

Precision Multilayer Fabrication

We coordinate with qualified U.S.-based PCB manufacturers equipped to support complex ATE builds. From 4-layer prototypes to 44+ layer high-density stackups, our fabrication partners deliver the consistency required for semiconductor test platforms.

Fabrication Capabilities

Material Types

FR-4 (High-Tg)
Polyimide
Rogers
Hybrid Material Stackups

Board Thickness

Standard and custom builds
High rigidity options

Hole Precision

Aspect Ratio up to 30:1
NPTH Tolerance ±0.001"
Hole-to-Hole Location
Accuracy ±0.001"

Layer Count

Up to 44+ layers

Dielectric

Minimum dielectric spacing per
stackup requirement
Controlled dielectric thickness

Trace Matching

Matched impedance ±5%

If you have any special requirements, please contact us and we can further discuss your ATE project.

Tell Us Your Fabrication Requirements