Engineering Oversight

From early design validation through PCB fabrication and precision assembly

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Design Review for ATE & DUT Interface Boards

Every project begins with a comprehensive engineering review of your ATE load board or DUT interface design files. We evaluate:

      • Controlled impedance requirements

      • High-speed signal routing

      • Material selection (FR4, Rogers, specialty laminates)

      • Via structures (blind, buried, microvias)

      • Mechanical tolerances, handler and prober and interface Aaignment

Early-stage validation reduces risk, shortens development cycles, and prevents costly redesigns before fabrication begins.

Stackup Planning & Controlled Impedance Engineering

High-performance ATE environments demand precision stackup design. We engineer layer structures that support:

      • 4–44+ layer PCB builds

      • Controlled impedance routing

      • High-speed and RF applications

      • Power integrity and signal isolation

      • Advanced via structures

Our stackup planning ensures electrical performance aligns with fabrication capability — critical for semiconductor test applications.

DFM Collaboration with Fabrication & Assembly Partners

Design for Manufacturability (DFM) is integrated into every project. We work closely with qualified PCB fabrication and PCB assembly partners to align design intent with production realities.

This includes:

      • Drill tolerances and aspect ratios

      • Material availability and lead times

      • Panelization strategy

      • Yield optimization

      • Assembly process validation

This collaborative approach ensures repeatable, production-ready ATE load boards and DUT interface boards.

Quality Oversight Throughout PCB Fabrication

Finley Design provides active oversight during ATE PCB fabrication and assembly to maintain precision and consistency.

We coordinate:

      • Fabrication checkpoints

      • Controlled impedance verification

      • Material certification review

      • Process documentation validation

Our engineering-focused approach ensures every board meets performance and reliability expectations for demanding test environments.

Assembly Inspection & Integration Readiness

Completed boards undergo detailed inspection prior to release. We verify:

      • Fine-pitch BGA and QFN placement

      • Connector alignment and mechanical interface accuracy

      • Structural components and stiffeners

      • Functional integration readiness

Every ATE load board and DUT interface assembly is reviewed to confirm it is ready for handler, tester, or prober integration.