Multilayer Construction
Via Technology
Trace & Space
Controlled Impedance
Base Materials
Copper Weights
Surface Finishes
Board Thickness

ATE load boards often require precise impedance control, power integrity management, and minimal signal degradation. We support stackup planning and routing strategies that preserve signal performance in high-frequency test environments.

SMT Capability
Through-Hole
Inspection
Prototype Builds
Production Runs
ATE boards often require structural reinforcement and precision mounting solutions. We provide custom PCB stiffeners and mechanical components to enhance durability and mechanical stability.




Layers: 4–44+
Via Types: Blind, Buried, Microvia
Materials: FR4, Rogers, Polyimide
Assembly: Fine-pitch BGA, AOI, X-ray