ATE PCB Capabilities 

Technical capabilities supporting complex ATE solutions.

Contact us to review your ATE project

Core Technical Capabilities

Fabrication Capabilities

Multilayer Construction

  • 4 to 44+ layers
  • Sequential lamination
  • Complex stackups
  • High aspect ratio vias

Via Technology

  • Blind vias
  • Buried vias
  • Microvias
  • Via-in-pad (filled & capped)

Trace & Space

  • Fine line routing
  • Tight tolerance control
  • HDI routing capability

Controlled Impedance

  • Single-ended & differential
  • Stackup modeling
  • Impedance test coupons

Materials & Finishes

Base Materials

  • High-Tg FR4
  • Rogers
  • Polyimide
  • Hybrid material stackups

Copper Weights

  • 0.5 oz – Heavy copper builds

Surface Finishes

  • ENIG
  • Immersion Silver
  • OSP
  • Lead-free HASL

Board Thickness

  • Standard & custom builds
  • High rigidity stackups
  • Controlled thickness tolerance

High-Speed & Signal Integrity Support

ATE load boards often require precise impedance control, power integrity management, and minimal signal degradation. We support stackup planning and routing strategies that preserve signal performance in high-frequency test environments.

  • Differential pair routing optimization
  • Controlled return paths
  • Power distribution plane design
  • Crosstalk mitigation
  • Stackup impedance modeling
  •  

Precision PCB Assembly

Assembly Specs

SMT Capability

  • Fine-pitch BGA
  • QFN
  • Double-sided SMT
  • High component density builds

Through-Hole

  • Selective solder
  • Mixed technology builds

Inspection

  • AOI
  • X-ray inspection (partner-supported)
  • Manual inspection protocols

Production Scale

Prototype Builds

  • Rapid-turn support
  • Low volume flexibility

Production Runs

  • Small-to-mid volume
  • Consistent build repeatability
  • Documentation control

Mechanical & Structural Integration

ATE boards often require structural reinforcement and precision mounting solutions. We provide custom PCB stiffeners and mechanical components to enhance durability and mechanical stability.

  • Custom PCB stiffeners
  • Precision machined components
  • Mounting hardware integration
  • Structural reinforcement for test environments

Quality & Process Oversight

  • Design for Manufacturability review
  • Stackup verification
  • Fabrication partner qualification
  • Documentation & revision control
  • IPC standards adherence
  • Inspection oversight
  • Assembly verification
  • Consistent process monitoring

Capability Snapshot

  • Layers: 4–44+

  • Via Types: Blind, Buried, Microvia

  • Materials: FR4, Rogers, Polyimide

  • Assembly: Fine-pitch BGA, AOI, X-ray

Have Technical Requirements to Review?

Upload your device pinlist, tester configuration, circuit requiremenmts handler or prober model to begin a capability assessment.
Request review and upload